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Tribology Letters

Volumn 21, Issue 1, 2006, Pages 45-50

Dry sliding tribological behavior of nanocrystalline and conventional polycrystalline copper

(3) Han, Zhong a Lu, L a Lu, K a

a INSTITUTE OF METAL RESEARCH (China)

Author keywords

Copper; Electrode position; Nanocrystalline; Unlubricated wear

Indexed keywords

COPPER; CRYSTAL MICROSTRUCTURE; ELECTRODEPOSITION; FRICTION; HARDNESS; NANOSTRUCTURED MATERIALS; POLYCRYSTALLINE MATERIALS; STRAIN HARDENING; TUNGSTEN CARBIDE; WEAR RESISTANCE;

DRY SLIDING TRIBOLOGICAL BEHAVIOR; NANOCRYSTALLINE COPPER; POLYCRYSTALLINE COPPER; UNLUBRICATED WEAR;

TRIBOLOGY;

COPPER; CRYSTAL MICROSTRUCTURE; ELECTRODEPOSITION; FRICTION; HARDNESS; NANOSTRUCTURED MATERIALS; POLYCRYSTALLINE MATERIALS; STRAIN HARDENING; TRIBOLOGY; TUNGSTEN CARBIDE; WEAR RESISTANCE;

EID: 33644909082 PISSN: 10238883 EISSN: None Source Type: Journal
DOI: 10.1007/s11249-005-9007-2 Document Type: Article

Times cited : (37)

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