Nanoimprint lithography: The semiconductor industry and beyond

Microlithography World

Volumn 15, Issue 1, 2006, Pages

  Luesebrink, Helge ^a  

^a EV GROUP   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; GLASS TRANSITION; MOLDING; PHOTOPOLYMERIZATION; STAMPING; TEMPERATURE; ULTRAVIOLET DEVICES;

HOT EMBOSSING; MICRO CONTACT PRINTING; NANOIMPRINT LITHOGRAPHY; UV-MOLDING;

LITHOGRAPHY;

EID: 33644901290     PISSN: 1074407X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (8)

1. International Technology Roadmap for Semiconductors, 2003.
2. "Nano-Imprint Lithography Standards," European Semiconductor web site, http://www.eurosemi.eu.com/front-end/features-full.php?id= 6528, Sept. 2005.
3. Paul Lindner, "Wafer Bonding: Key Enabling Technology in High-Volume Sensor Production," MST news, No 01/03, pp. 46-47, February 2003.
4. Neil S. Cameron, Teodor Veres, Sahil Kappur, Mandy Esch, "Development of Hot-embossing/Nano-imprint Lithography (HEL/NIL): Parameters for large-scale functional surfaces and templates," NanoCrossRoads Conference, Montréal, Nov. 2002.
5. Trademark of Molecular Imprints.
6. B. Michel, A. Bernard, A. Bietsch, E. Delamarche, M. Geissler, et al., "Printing Meets Lithography: Soft Approaches to High-resolution Patterning," J. Res. & Dev., Vol. 45, No. 5, September 2001.
7. Jacques Beauvais, et al., "Faithful Replication? Metrology Comparison for Raised/Recessed Features with UV-NIL," Proceedings, MNE2005.
8. Thomas Glinsner, et al., "Nanoimprint Lithography Enables Patterned Tracks for High-Capacity Hard Disks," Solid State Technology. p. 51, March 2005.