Creep transients during stress changes in ultrafine-grained copper

Scripta Materialia

Volumn 54, Issue 10, 2006, Pages 1803-1807

  Kapoor, R ^a   Li, Y J ^b   Wang, J T ^c   Blum, W ^b  

^a BHABHA ATOMIC RESEARCH CENTRE   (India)

^b UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

^c NANJING UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Equal channel angular pressing (ECAP); Severe plastic deformation; Subgrain boundary; Transients; Ultrafine grained Cu

Indexed keywords

CREEP; GRAIN SIZE AND SHAPE; PLASTIC DEFORMATION; STRESS ANALYSIS; TRANSIENTS;

EQUAL CHANNEL ANGULAR PRESSING (ECAP); SEVERE PLASTIC DEFORMATION; SUBGRAIN BOUNDARY; ULTRAFINE-GRAINED CU;

COPPER;

EID: 33644899999     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2006.01.032     Document Type: Article

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