High thermal conductivity aluminum nitride substrates prepared by aqueous tape casting

Journal of the American Ceramic Society

Volumn 89, Issue 3, 2006, Pages 836-841

  Luo, Xiaojun ^a   Li, Jun ^a   Zhang, Baolin ^a   Li, Wenlan ^a   Zhuang, Hanrui ^a  

^a SHANGHAI INSTITUTE OF CERAMICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BALL MILLING; GRAIN BOUNDARIES; OXYGEN; PH EFFECTS; SINTERING; THERMAL CONDUCTIVITY;

AQUEOUS TAPE CASTING; BALL-BILLING MEDIA; PRESSURELESS SINTERING;

ALUMINUM NITRIDE;

EID: 33644685363     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2005.00828.x     Document Type: Article

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