Rework of flip-chip populated PCBs by laser desoldering

Proceedings of the International Spring Seminar on Electronics Technology

Volumn 2001-January, Issue , 2001, Pages 63-67

  Hanreich, G ^a   Wolter, K J ^b   Nicolics, J ^a  

^a VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CONCURRENT ENGINEERING; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; LASER APPLICATIONS; ORGANIC POLLUTANTS; PRINTED CIRCUIT BOARDS;

ATTACHMENT PROCESS; ELECTRONIC COMPONENT; EXPERIMENTAL INVESTIGATIONS; EXPERIMENTAL SET UP; PROCESS PARAMETERS; PROCESS SIMULATIONS; TEMPERATURE-DEPENDENT MATERIAL PROPERTIES; THERMAL SIMULATION TOOL;

CHIP SCALE PACKAGES;

EID: 33644520157     PISSN: 21612528     EISSN: 21612536     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2001.931013     Document Type: Conference Paper

References (8)

1. Gautam Sarkar, Mridha, S, Tan Tin Chong, Wu Yuen Tuck, Sem Chi Kwan: "Flip chip interconnect using anisotropic conductive adhesive", Journal of Materials Processing Technology, Vol. 89-90, 1999, pp. 484-490.
2. Rösner, B: "Thermal examinations of flip-chip assemblies", VTE Packaging and Interconnection Technology in Electronics, Vol. 9, No. 6, 1997, pp. E89-E92.
3. Wolter, K.-J: "HDI-assemblies-demands and challenges", VTE Packaging and Interconnection Technology in Electronics, Vol. 12, No. 4, 2000, pp. E50-E54.
4. Yi He, Moreira B. E, Overson, A, Nakamura, S. H, Bider, C, Briscoe J. F: "Thermal characterization of an epoxy-based underfill material for flip chip packaging", Thermochimica Acta, Vol. 357-358, 2000, pp. 1-8.
5. Crane, L, Torres, A, Yaeger, E: "Reworkable Underfills Developement, Processing and Reliability", Loctite, http://www.loctite.com/electronics-html/reworkable-underfills2000.pdf
6. Hanreich, G, Nicolics, J, Musiejovsky, L: "High resolution thermal simulation of electronic components", Microelectronics Reliability, 40, 2000, pp. 2069-2076.
7. Hanreich, G, Nicolics, J, Stangl, G: "Investigation of the thermal performance of micro-whisker structured silicon heat spreaders for power devices", Microelectronics Journal, 31, 2000, No. 11-12, pp. 969-973.
8. Hanreich, G, Nicolics, J, Enigl, R: "Determination of the Heat Transfer by Natural Convection at the Surface of Electronic Components", Proc. of 23rd International Spring Seminar on Electronics Technology, ISSE 2000, Hotel UNI, Balatonfüred, Hungary, 6.-10. May 2000, pp. 191-196.