Heat load test of beryllium and CuCrZr joints

Journal of Nuclear Materials

Volumn 329-333, Issue 1-3 PART A, 2004, Pages 885-888

  Yamada, H ^a   Uchida, M ^a   Uda, M ^b   Iwadachi, T ^b   Nakamichi, M ^a   Kawamura, H ^c  

^a JAPAN ATOMIC ENERGY AGENCY   (Japan)

^b NGK INSULATORS LTD   (Japan)

^c JAPAN ATOM ENER RESEARCH INSTITUTE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BERYLLIUM; BONDING; COMPOSITION; COPPER; HEAT FLUX; HOT ISOSTATIC PRESSING; THERMAL LOAD;

BONDING TECHNOLOGY; HEAT LOAD TESTS; HEAT REMOVAL;

NUCLEAR REACTORS;

EID: 3342950409     PISSN: 00223115     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jnucmat.2004.04.281     Document Type: Conference Paper

References (5)

1. T. Hatano, T. Kuroda, M. Enoeda, M. Uchida, E. Ishitsuka, Y. Ohara, Qualification of Be and Be/Cu joints and mock-ups testing, ITER R&D Task Report, G16TT103FJ, T508, 2001.
2. T. Makino, T. Iwadachi, Interface structure of Be/DSCu diffusion bonding, JAERI-Conf 98-001, 1998, p. 107.
3. B.C. Odegard Jr., C.H. Cadden, Solid state bonding of beryllium-copper for an ITER first wall application, JAERI-Conf 98-001, 1998, p. 123.
4. H. Kawamura, Review of R&D Status on Beryllium Technology for Fusion in Japan, Reported at the Fifth IEA International Workshop on Beryllium Technology for Fusion, JAERI-Review 2002-011, 2002.
5. Uchida M., Ishitsuka E., et al. J. Nucl. Mater. 307-311:2002;1533.