Heat load test of Be/Cu joint for ITER first wall mock-ups

Journal of Nuclear Materials

Volumn 307-311, Issue 2 SUPPL., 2002, Pages 1533-1536

  Uchida, M ^a   Ishitsuka, E ^a   Hatano, T ^a   Barabash, V ^b   Kawamura, H ^a  

^a JAPAN ATOMIC ENERGY AGENCY   (Japan)

^b International Thermonuclear Experimental Reactor ITER Garching   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BERYLLIUM; COPPER; CRACK INITIATION; FABRICATION; HEAT FLUX; HOT ISOSTATIC PRESSING; THERMAL CYCLING;

FIRST WALL MOCK-UPS;

THERMAL LOAD;

EID: 0036955145     PISSN: 00223115     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-3115(02)01168-6     Document Type: Article

References (10)

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2. Makino T., Iwatachi T. Interface structure of Be/DSCu diffusion bonding. JAERI-Conf. 98-001:1998;107.
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