Formation of Cu-Sn alloy layer by contact deposition using quaternary ammonium-imide-type ionic liquid

Electrochemical and Solid-State Letters

Volumn 9, Issue 4, 2006, Pages

  Katase, Takuma ^a   Kurosaki, Ryoichi ^a   Murase, Kuniaki ^a,b   Hirato, Tetsuji ^a,b   Awakura, Yasuhiro ^a  

^a KYOTO UNIVERSITY   (Japan)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; AMMONIUM COMPOUNDS; DEPOSITION; ELECTROLYTIC ANALYSIS; INTERDIFFUSION (SOLIDS);

AMMONIUM-IMIDE; CU-SN ALLOY; ELECTROLYTIC BATH; IONIC LIQUIDS;

PEWTER;

EID: 33244489568     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2171814     Document Type: Article

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