Thermal interfiber bonding of electrospun poly(L-lactic acid) nanofibers

Materials Letters

Volumn 60, Issue 11, 2006, Pages 1331-1333

  You, Young ^a   Lee, Sung Won ^a   Jin Lee, Seung ^b   Park, Won Ho ^a  

^a Chungnam National University   (South Korea)

^b Ewha Womans University   (South Korea)

Author keywords

Electrospinning; Elongation at break; Poly(L lactic acid) (PLA); Tensile strength

Indexed keywords

ELECTROSLAG PROCESS; HEAT TREATMENT; MELTING; NANOSTRUCTURED MATERIALS; SHRINKAGE; TENSILE STRENGTH; THERMOANALYSIS;

BONDED PLA NANOFIBROUS; ELECTROSPINNING; ELONGATION AT BREAKS; POLY(L-LACTIC ACID) (PLA);

POLYMERS;

EID: 33144473071     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2005.11.022     Document Type: Article

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