Formation of interfiber bonding in electrospun poly(etherimide) nanofiber web

Journal of Materials Science

Volumn 39, Issue 4, 2004, Pages 1511-1513

  Choi, Sung Seen ^a   Lee, Seung Goo ^b   Joo, Chang Whan ^b   Im, Seung Soon ^c   Kim, Seong Hun ^c  

^a Sejong University   (South Korea)

^b Chungnam National University   (South Korea)

^c Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

EVAPORATION; GLASS TRANSITION; HEAT TREATMENT; INJECTION MOLDING; MORPHOLOGY; POLYETHERIMIDES; SCANNING ELECTRON MICROSCOPY; SOLVENTS; STRESSES; TENSILE STRENGTH; THERMODYNAMIC PROPERTIES; THERMOGRAVIMETRIC ANALYSIS;

ELECTROSPINNING; ELECTROSPUN NANOFIBER WEB; INTERFIBER BONDING; WEIGHT REDUCTIONS;

NANOSTRUCTURED MATERIALS;

EID: 1442286959     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JMSC.0000013931.84760.b0     Document Type: Article

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