메뉴 건너뛰기




Volumn 37, Issue 4, 2006, Pages 565-570

Warpage induced in bi-material specimens: Coefficient of thermal expansion, chemical shrinkage and viscoelastic modulus evolution during cure

Author keywords

A. Thermosetting resins; B. Cure behaviour; D. Process monitoring; Thermo mechanical analysis

Indexed keywords

FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SHRINKAGE; THERMOMECHANICAL TREATMENT; THERMOSETS; VISCOELASTICITY;

EID: 33144461669     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2005.05.012     Document Type: Article
Times cited : (42)

References (12)
  • 1
    • 0033902073 scopus 로고    scopus 로고
    • Modeling the evolution of the dynamic mechanical properties of a commercial epoxy during cure after gelation
    • S.L. Simon, G.B. McKenna, and O'Sindt Modeling the evolution of the dynamic mechanical properties of a commercial epoxy during cure after gelation J Appl Polym Sci 76 2000 495 508
    • (2000) J Appl Polym Sci , vol.76 , pp. 495-508
    • Simon, S.L.1    McKenna, G.B.2    O'Sindt3
  • 3
    • 0037138343 scopus 로고    scopus 로고
    • Study on the volumetric expansion of benzoxazine curing with different catalysts
    • Xin Liu, and Yi Gu Study on the volumetric expansion of benzoxazine curing with different catalysts J Appl Polym Sci 84 6 2002 1107 1113
    • (2002) J Appl Polym Sci , vol.84 , Issue.6 , pp. 1107-1113
    • Xin, L.1    Yi, G.2
  • 4
    • 0027005584 scopus 로고
    • Process modeling of composite materials: Residual stress development during cure. Part I. Model formulation
    • S.R. White, and H.T. Hahn Process modeling of composite materials: residual stress development during cure. Part I. Model formulation J Compos Mater 26 1992 2402
    • (1992) J Compos Mater , vol.26 , pp. 2402
    • White, S.R.1    Hahn, H.T.2
  • 5
    • 0026974626 scopus 로고
    • Process modeling of composite materials: Residual stress development during cure. Part II. Experimental validation
    • S.R. White, and H.T. Hahn Process modeling of composite materials: residual stress development during cure. Part II. Experimental validation J Compos Mater 26 1992 2423
    • (1992) J Compos Mater , vol.26 , pp. 2423
    • White, S.R.1    Hahn, H.T.2
  • 6
    • 0030379041 scopus 로고    scopus 로고
    • Stress relaxation behaviour of 3501-6 epoxy resin during cure
    • Y.K. Kim, and S.R. White Stress relaxation behaviour of 3501-6 epoxy resin during cure Polym Eng Sci 36 1996 2020 2033
    • (1996) Polym Eng Sci , vol.36 , pp. 2020-2033
    • Kim, Y.K.1    White, S.R.2
  • 7
    • 33144463021 scopus 로고    scopus 로고
    • Process-induced residual stress analysis of AS4/3501-6 composite material
    • S.R. White, and Y.K. Kim Process-induced residual stress analysis of AS4/3501-6 composite material Mech Compos Mater Struct 1997 361 387
    • (1997) Mech Compos Mater Struct , pp. 361-387
    • White, S.R.1    Kim, Y.K.2
  • 8
    • 0043186607 scopus 로고    scopus 로고
    • ISO/FDIS 11359 to be approved
    • Final Draft, ISO/FDIS 11359 to be approved, (1999).
    • (1999) Final Draft
  • 9
    • 0036938121 scopus 로고    scopus 로고
    • Investigation of cure induced shrinkage in unreinforced epoxy resin
    • M. Zarrelli, A.A. Skordos, and I.K. Partridge Investigation of cure induced shrinkage in unreinforced epoxy resin Plastics Rubber Compos 31 9 2002
    • (2002) Plastics Rubber Compos , vol.31 , Issue.9
    • Zarrelli, M.1    Skordos, A.A.2    Partridge, I.K.3
  • 12
    • 33144461382 scopus 로고    scopus 로고
    • M. Zarrelli (unpublished work)
    • M. Zarrelli (unpublished work).


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.