Single-wafer tool performs re-contamination free in wet wafer cleaning

ECS Transactions

Volumn 1, Issue 3, 2006, Pages 150-157

  Liu, Lewis ^a   Walter, Alan ^a   Novak, Rich ^a  

^a Akrion   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTAMINATION; DECONTAMINATION; ENGINEERS; IMPURITIES; PARAMETER ESTIMATION; SILICON;

CENTRIFUGAL FORCES; SEMICONDUCTOR MANUFACTURING; WAFER SURFACES; WET WAFER CLEANING;

SEMICONDUCTOR MATERIALS;

EID: 32844467444     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

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2. T. Hattori, J. of Micro, p.49-57 (Jan./Feb., 2003)
3. C. Beaudry, J. Baker, R. Gouk and S. Verhaverbeke, Particles on Surface 8: Detection, Adhesion and Removal, K. L. Mittal (ed.), p.271-277, VSP (2003)
4. J. Lauerhaas, Y. Wu, K. Xu, G. Vereecke, R. Vos, K. Kenis, P. Mertens, T. Nicolosi and M. Heyns, Electrochem. Soc. Proceedings Vol.2001-26, p.147-155 (2001)
5. R. Donovan and V. Menon, Particle Deposition and Adhesion, Handbook of Semiconductor Wafer Cleaning Technology: Science, Technology, and Applications, Werner Kern (ed.), p.192-193, Noyes Publications, Mill Road, Park Ridge, New Jersey 07656 (1993)