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Surface and Coatings Technology

Volumn 200, Issue 12-13, 2006, Pages 3987-3995

Residual stress control in TiN/Si coatings deposited by unbalanced magnetron sputtering

(1) Bielawski, Mariusz a

a NATIONAL RESEARCH COUNCIL CANADA (Canada)

Author keywords

Magnetron; Reactive sputtering; Residual stress; Thermal relaxation; Titanium nitride

Indexed keywords

MAGNETRON SPUTTERING; RESIDUAL STRESSES; SILICON WAFERS; SPUTTER DEPOSITION; STRESS RELAXATION; THERMAL STRESS; TITANIUM NITRIDE;

REACTIVE SPUTTERING; RESIDUAL STRESS CONTROL; THERMAL RELAXATION;

PROTECTIVE COATINGS;

MAGNETRON SPUTTERING; PROTECTIVE COATINGS; RESIDUAL STRESSES; SILICON WAFERS; SPUTTER DEPOSITION; STRESS RELAXATION; THERMAL STRESS; TITANIUM NITRIDE;

EID: 32844454699 PISSN: 02578972 EISSN: None Source Type: Journal
DOI: 10.1016/j.surfcoat.2005.06.004 Document Type: Article

Times cited : (59)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.