Influence of codeposition of copper on the structure and morphology of electroless Ni-W-P alloys from sulphate- and chloride-based baths

Surface and Coatings Technology

Volumn 200, Issue 12-13, 2006, Pages 3675-3681

  Balaraju, J N ^a   Anandan, C ^a   Rajam, K S ^a  

^a SURFACE ENGINEERING DIVISION   (India)

Author keywords

AFM; Electroless Ni W P; Hardness; Ni W Cu P; SEM; XPS; XRD

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; ELECTROLESS PLATING; GRAIN SIZE AND SHAPE; HARDNESS; MORPHOLOGY; NICKEL COMPOUNDS; PROTECTIVE COATINGS; SCANNING ELECTRON MICROSCOPY; TERNARY SYSTEMS; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER CODEPOSITION; ELECTROLESS ALLOYS; QUATERNARY COATINGS;

NICKEL ALLOYS;

ATOMIC FORCE MICROSCOPY; COPPER; ELECTROLESS PLATING; GRAIN SIZE AND SHAPE; HARDNESS; MORPHOLOGY; NICKEL ALLOYS; NICKEL COMPOUNDS; PROTECTIVE COATINGS; SCANNING ELECTRON MICROSCOPY; TERNARY SYSTEMS; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 32644480277     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2004.09.010     Document Type: Article

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