Thermal management of VCSEL-based optoelectronic modules

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 3, 1996, Pages 540-547

  Lee, Yung Cheng ^b   Swirhun, Stanley E ^a,c   Fu, Winston S ^d   Keyser, Tim A ^e   Jewell, Jack L ^f   Quinn, William E ^g  

^a IEEE

^b UCB 450   (United States)

^c Vixel Corporation   (United States)

^d NORTHWESTERN UNIVERSITY   (United States)

^e Western Wireless Corporation   (United States)

^f Picolight Inc   (United States)

^g RAYTHEON COMPANY   (United States)

Author keywords

Flip chip; Modeling; Thermal management; VCSEL

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; HEAT RESISTANCE; HEAT SINKS; MATHEMATICAL MODELS; SEMICONDUCTOR LASERS; THREE DIMENSIONAL;

THERMAL MANAGEMENT; VERTICAL CAVITY SURFACE EMITTING LASERS;

OPTOELECTRONIC DEVICES;

EID: 0030212321     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.533893     Document Type: Article

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