Pole-residue formulation for transient simulation of high-frequency interconnects using householder LS curve-fitting techniques

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 2, 2000, Pages 142-147

  Elzinga, Mark ^a,b   Virga, Kathleen L ^b   Zhao, Li ^c   Prince, John L ^d  

^a IEEE

^b INTEL CORPORATION   (United States)

^c University of Arizona   (United States)

^d ANSYS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; APPROXIMATION THEORY; COMPUTER SIMULATION; CURVE FITTING; FUNCTIONS; SEMICONDUCTOR DEVICE MODELS; TIME DOMAIN ANALYSIS;

CIRCUIT SIMULATOR; INTERCONNECTS; POLE RESIDUE APPROXIMATION; RATIONAL FUNCTION APPROXIMATION; SIMULATION PROGRAM WITH INTEGRATED CIRCUIT EMPHASIS;

INTEGRATED CIRCUIT LAYOUT;

EID: 0033703502     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.846624     Document Type: Article

References (8)

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