An accurate experimental method for characterizing transmission lines embedded in multilayer printed circuit boards

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 1, 2006, Pages 114-121

  Narita, Kaoru ^a   Kushta, Taras ^a  

^a NEC CORPORATION   (Japan)

Author keywords

Characteristics impedance; Propagation constant; Strip line; Through holes; Vias

Indexed keywords

APPROXIMATION THEORY; BANDWIDTH; ELECTRIC IMPEDANCE; ELECTRIC LINES; PRINTED CIRCUIT BOARDS;

CHARACTERISTICS IMPEDANCE; MULTILAYER PRINTED CIRCUIT BOARDS; PROPAGATION CONSTANT; THROUGH HOLES;

MICROSTRIP LINES;

EID: 32444436228     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.849543     Document Type: Article

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