A parametric study of dielectric spray cooling of a row of heaters in a narrow channel

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2002, Pages 164-168

  Kearns, Don ^a   Du, Jian Hua ^b   Chen, Ruey Hung ^c   Chow, Louis C ^c  

^a SUN MICROSYSTEMS   (United States)

^b TSINGHUA UNIVERSITY   (China)

^c UNIVERSITY OF CENTRAL FLORIDA   (United States)

Author keywords

ASIC; Cooling; Dielectric liquid; Electronics; Evaporation; High power; Spray

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; DIELECTRIC LIQUIDS; EVAPORATION; HEAT LOSSES; HEAT TRANSFER;

DIELECTRIC SPRAY COOLING;

COOLING;

EID: 0036221136     PISSN: 10652221     EISSN: None     Source Type: Journal    
DOI: 10.1109/STHERM.2002.991363     Document Type: Article

References (11)

1. Bubble behavior and nucleate boiling heat transfer in saturated FC-72 spray cooling
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3. Surface roughness and its effects on the heat transfer mechanism in spray cooling
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5. Liquid immersion cooling of a longitudinal array of discrete heat sources in protruding substrates: II-forced convection boiling
6. Forced convection boiling from an array of in-line heat sources in a flow channel
7. Gas-assisted evaporative cooling of high density electronic modules
8. Cooling of a heated surface by mist flow