|
Volumn 380, Issue 1-2, 2004, Pages 231-236
|
Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages
|
Author keywords
Coefficient of thermal expansion (CTE); Electronic speckle pattern interferometry (ESPI); Finite element analysis (FEA); Flip chip package; Shear strain
|
Indexed keywords
DEFORMATION;
FINITE ELEMENT METHOD;
INTERFEROMETRY;
SOLDERED JOINTS;
ELECTRONIC SPECKLE-PATTERN INTERFEROMETRY (ESPI);
FLIP-CHIP PACKAGES;
SPECKLE;
INTERFEROMETRY;
|
EID: 3242696771
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2004.03.068 Document Type: Article |
Times cited : (15)
|
References (13)
|