메뉴 건너뛰기




Volumn 380, Issue 1-2, 2004, Pages 231-236

Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages

Author keywords

Coefficient of thermal expansion (CTE); Electronic speckle pattern interferometry (ESPI); Finite element analysis (FEA); Flip chip package; Shear strain

Indexed keywords

DEFORMATION; FINITE ELEMENT METHOD; INTERFEROMETRY; SOLDERED JOINTS;

EID: 3242696771     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2004.03.068     Document Type: Article
Times cited : (15)

References (13)
  • 10
    • 85161699872 scopus 로고    scopus 로고
    • ABAQUS/Standard, Hibbitt, Karlsson and Sorensen, Inc., RI
    • ABAQUS/Standard, Hibbitt, Karlsson and Sorensen, Inc., RI, 1998.
    • (1998)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.