Al/SiC carriers for microwave integrated circuits by a new technique of pressureless infiltration

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 29, Issue 1, 2006, Pages 58-63

  Rao, Boddapati Srinivasa ^a   Hemambar, Ch ^b   Pathak, A V ^c   Patel, K J ^c   Rödel, Jürgen ^a   Jayaram, Vikram ^b  

^a DARMSTADT UNIVERSITY OF TECHNOLOGY   (Germany)

^b INDIAN INSTITUTE OF SCIENCE   (India)

^c Indian Space Research Organization Space Application Centre   (India)

Author keywords

Al SiC; Coefficient of thermal expansion (CTE); Electronic packaging microwave integrated circuit (MIC) carrier; Pressureless infiltration in air; Thermal diffusivity

Indexed keywords

CHARGE CARRIERS; ELECTRONICS PACKAGING; HEAT LOSSES; INFILTRATION; INTERFACES (MATERIALS); MICROCRACKS; SEMICONDUCTOR MATERIALS; THERMAL CONDUCTIVITY; THERMAL DIFFUSION; THERMAL EFFECTS; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION; MICROPORES; PRESSURELESS INFILTRATION; THERMAL DIFFUSIVITY;

MICROWAVE INTEGRATED CIRCUITS;

EID: 32144451676     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.862627     Document Type: Article

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