Al-SiC electronic packages with controlled thermal expansion coefficient by a new method of pressureless infiltration

Materials and Manufacturing Processes

Volumn 16, Issue 6, 2001, Pages 779-788

  Hemambar, Ch ^a   Srinivasa Rao, B ^a   Jayaram, V ^a  

^a INDIAN INSTITUTE OF SCIENCE   (India)

Author keywords

Al SiC composites; AlSiC; Electronic packaging; Low thermal expansion coefficient; Metal matrix composites; Near net shape fabrication; Pressureless infiltration

Indexed keywords

ALUMINUM ALLOYS; INFILTRATION; METALLIC MATRIX COMPOSITES; MICROWAVE INTEGRATED CIRCUITS; SILICON CARBIDE; THERMAL EXPANSION;

ELECTRONIC PACKAGES; PRESSURELESS INFILTRATION;

ELECTRONICS PACKAGING;

EID: 0035502845     PISSN: 10426914     EISSN: None     Source Type: Journal    
DOI: 10.1081/AMP-100108698     Document Type: Article

References (17)

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8. The fabrication of metal matrix composites by pressureless infiltration technique
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12. 3 preforms
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14. Wettability of SiC by aluminium and Al-Si alloys
15. Interface reactions and phase stability in the Al-SiC system
16. Coefficients of thermal expansion of metal-matrix composites for electronic packaging