Super resolution speckle method with SEM and TEM

Proceedings of the 2005 SEM Annual Conference and Exposition on Experimental and Applied Mechanics

Volumn , Issue , 2005, Pages 865-869

  Chiang, Fu Pen ^a   Chang, Sheng ^a  

^a Stony Brook University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICRONS; SPATIAL RESOLUTION; SPECKLE PATTERNS;

ALGORITHMS; COMPUTER AIDED ANALYSIS; SCANNING ELECTRON MICROSCOPY; SPECKLE; TRANSMISSION ELECTRON MICROSCOPY;

INTERFEROMETRY;

EID: 32044456956     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. F.P. Chiang, Q. Wang, and Lehman, F., "New Developments in Full Field Strain Measurements Using Speckles", Nontraditional Methods of Sensing Stress, Strain and Damage in Materials and Structures, ASTM STP 1318, George F. Lucas and David A. Stubbs, Eds., American Society for Testing and Materials, pp. 156-169, 1997
2. Chen, D.J. and Chiang, F.P., "Computer Aided Speckle Interferometry Using Spectral Amplitude Fringes", Applied Optics 3(2), 225-236, 1993.
3. Chen, D.J., Chiang, F.P., Tan, Y.S. and Don, H.S., "Digital Speckle-Displacement Measurement Using a Complex Spectrum Method", Applied Optics, 32(11), pp. 1839-1849, 1993.