New developments in full field strain measurements using speckles

ASTM Special Technical Publication

Volumn 1318, Issue , 1997, Pages 156-169

  Chiang, Fu Pen ^a   Wang, Qing ^a   Lehman, Fred ^b  

^a Stony Brook University   (United States)

^b INSTRON   (United Kingdom)

Author keywords

Digital image processing; Electron microscope; Experimental mechanics; Interferometry; Micro mechanics; Speckle; Stress strain analysis

Indexed keywords

COMPOSITE MICROMECHANICS; DIGITAL IMAGE STORAGE; ELECTRON MICROSCOPY; IMAGE ANALYSIS; INTERFEROMETRY; PHOTOGRAPHY; SPECKLE; STRESS ANALYSIS;

SPECKLE INTERFEROMETRY; SPECKLE PHOTOGRAPHY; STRAIN ANALYSIS;

STRAIN MEASUREMENT;

EID: 0031213176     PISSN: 00660558     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (16)

1. Erf, R. K., Speckle Metrology, Academic Press, 1978.
2. Chiang, F. P., "A New Family of 2D and 3D Experimental Stress Analysis Techniques Using Laser Speckles," Solid Mechanics Archives, 3(1), pp1-32, 1978
3. Chiang, F. P., "Speckle Metrology," Metals Handbook, 9th edition, Vol. 17, pp 432-437.
4. Asundi, A. and Chiang, F. P., "Theory and Applications of the White Light Speckle Method for Strain Analysis," Optical Engineering, 24(4), pp 570-580, 1982.
5. Chiang, F. P., "Speckle Method with Electron Microscope," Society for Experimental Stress Analysis, Spring Meeting, HI, May 23-28, 1982.
6. Chen, D. J. and Chiang, F. P., "Computer-Aided Speckle Interferometry Using Spectral Amplitude Fringes," Applied Optics, 32(2), pp 225-236, 1993
7. Chen, D. J., Chiang, F. P, Tan, Y. S. and Don, H. S., "Digital Speckle-Displacement Measurement Using a Complex Spectrum Method," Applied Optics, 32(11), pp 1839-1849, 1993.
8. Rosenfeld, A. and Kak, A. C., Digital Picture Processing, Second edition, Academic press, 1982.
9. Peter, W. H., Ranson, W. F., "Digital Imaging Techniques in Experimental Stress Analysis," Optical Engineering, 21(3), pp 427-431, 1982.
10. Lehman, F., "Local Deformation Field Measurement Using Digital Speckle Photography," Proceedings of the Conference of Local Strain and Temperature Measurements in Non-Uniform Fields at Elevated Temperature, Berlin, Germany, March 14-15, 1996.
11. Wang, Q. and Chiang, F. P., "Experimental Characterization of Interphase Mechanical Properties of Composite," Composite Engineering, in press, 1996.
12. Wang, Q. and Chiang, F. P., "Experimental Study on the Mechanical Behavior of a Single Fiber," Material Research Society, Fall Meeting, Boston, MA, November 27-December 2, 1994.
13. Yan, X. T., Wang, Q. and Chiang, F. P., "On Stress Singularity at the interfacial Crack Tip - An Experimental Study," Proceedings of the American Society for Composite, 9th Technical Conference, Newark, DE, September 20-22, 1994, pp1036-1041.
14. Wang, Q. and Chiang, F. P., "Micro-mechanical Behavior of Polymer Interface Reinforced with Copolymers," Proceedings of Material Research Society, Fall Meeting, Symposium Q, Boston, MA, November 27-December 1, 1995, in press.
15. Wang, Y. Y., Wang, Q. and Chiang, F. P., "Study of Effect of Thickness on Mechanical Properties of Adhesive Material by SIEM," Proceedings of the 18th Annual Meeting of Adhesive Society, Hilton Head, SC, February 19-22, 1995, pp 325-327.
16. Wang, Q. and Chiang, F. P., "Micro-buckling Behavior of Graphite/PEEK Composite," Society of Engineering Science, 32nd Annual Technical Meeting, New Orleans, LA, October 29-November 2, 1995.