Modeling and parameter analysis of plasma cleaning

Surface and Coatings Technology

Volumn 200, Issue 10 SPEC. ISS., 2006, Pages 3370-3375

  Li, Chuan ^a   Hsieh, J H ^b   Cheng, Jui Ching ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b MING CHI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^c CHANG GUNG UNIVERSITY   (Taiwan)

Author keywords

Coatings; Deposition; Plasma cleaning; Sputtering

Indexed keywords

COATINGS; EQUATIONS OF MOTION; MATHEMATICAL MODELS; PLASMA APPLICATIONS; SPUTTER DEPOSITION; STEADY FLOW;

INFLOW RATE; ION SPUTTERING; PARAMETER ANALYSIS; PLASMA CLEANING; REACTIVE GAS CONCENTRATION; REACTIVE SPUTTERING;

SURFACE CLEANING;

COATINGS; EQUATIONS OF MOTION; MATHEMATICAL MODELS; PLASMA APPLICATIONS; SPUTTER DEPOSITION; STEADY FLOW; SURFACE CLEANING;

EID: 31744442450     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2005.07.054     Document Type: Article

References (14)

1. G.S. Oehrlein G.J. Scilla S.J. Jeng Appl. Phys. Lett. 52 1988 907
2. A. Callegari P.D. Hoh D.A. Buchanan D. Lacey Appl. Phys. Lett. 54 1989 332
3. N. Kondo Y. Nanishi Jpn. J. Appl. Phys. 28 1989 L7
4. R. Winter D. Korzec J. Engemann Surf. Coat. Technol. 93 1997 134
5. M. Mozetič A. Zalar Vacuum 71 2003 233
6. S.M. Hues R.J. Colton J.R. Wyatt J. Vac. Sci. Technol., A 7 1989 3126
7. S. Berg H.O. Blom T. Larsson C. Nender J. Vac. Sci. Technol., A 5 1987 202
8. S. Berg T. Larsson C. Nender H.O. Blom J. Appl. Phys. 63 1988 887
9. S. Berg H.O. Blom M. Moradi C. Nender J. Vac. Sci. Technol., A 7 1989 1225
10. S. Berg T. Nyberg H.O. Blom C. Nender D.A. Glocker S.I. Shah Handbook of Thin Film Process Technology 1998 Institute of Physics Publishing Bristol
11. M. Ohring Materials Science of Thin Films 2nd. ed. 2002 Academic Press San Diego
12. M. Lieberman A. Lichtenberg Principles of Plasma Discharges and Materials Processing 2nd ed. 1994 John Wiley & Sons New York
13. C. Li J.H. Hsieh J. Phys., D 37 2004 1065
14. H. Bartzsch P. Frach Surf. Coat. Technol. 142-144 2001 192