Time-resolving image analysis of drilling of thin silicon substrates with femtosecond laser ablation

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 44, Issue 11, 2005, Pages 7998-8003

  Yokotani, Atsushi ^a   Mukumoto, Toru ^a   Kanamitsu, Yasushi ^a   Fukumoto, Hideto ^a   Kurosawa, Kou ^a  

^a UNIVERSITY OF MIYAZAKI   (Japan)

Author keywords

Drilling; Femtosecond laser; Image intensified CCD camera; Thermal effect; Thin silicon substrate; Time resolved imaging

Indexed keywords

CHARGE COUPLED DEVICES; DRILLING; IMAGE ANALYSIS; LASER ABLATION; LASER PULSES; SILICON WAFERS; THERMAL CONDUCTIVITY;

FEMTOSECOND LASER; THIN SILICON SUBSTRATE; TIME-RESOLVED IMAGING;

SILICON;

EID: 31544476247     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.44.7998     Document Type: Article

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