Micromechanics-BE solution for properties of piezoelectric materials with defects

Engineering Analysis with Boundary Elements

Volumn 28, Issue 7, 2004, Pages 809-814

  Qin, Qing Hua ^a,b,c  

^a TIANJIN UNIVERSITY   (China)

^b UNIVERSITY OF SYDNEY   (Australia)

^c AUSTRALIAN NATIONAL UNIVERSITY   (Australia)

Author keywords

Boundary element method; Crack; Micromechanics; Piezoelectric

Indexed keywords

ALGORITHMS; BOUNDARY ELEMENT METHOD; COMPOSITE MICROMECHANICS; COMPUTER SIMULATION; CRACKS; ITERATIVE METHODS; PROBLEM SOLVING;

BOUNDARY DISPLACEMENT; BOUNDARY TRACTIONS; MICROVOIDING;

PIEZOELECTRIC MATERIALS;

EID: 3142778521     PISSN: 09557997     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.enganabound.2003.12.006     Document Type: Article

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