Effective moduli for thermopiezoelectric materials with microcracks

International Journal of Fracture

Volumn 91, Issue 4, 1998, Pages 359-371

  Qin, Qing Hua ^a   Mai, Yiu Wing ^a   Yu, Shou Wen ^b  

^a UNIVERSITY OF SYDNEY   (Australia)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

Effective moduli; Microcracks; Numerical techniques; Thermopiezoelectric materials

Indexed keywords

ALGEBRA; MATHEMATICAL MODELS; MICROCRACKS; PIEZOELECTRIC MATERIALS; THERMOELASTICITY; THERMOELECTRICITY;

THERMOPIEZOELECTRIC MATERIALS;

FRACTURE MECHANICS;

EID: 0032256164     PISSN: 03769429     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1007423508650     Document Type: Article

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