Ultrasonic attenuation due to grain boundary scattering in copper and copper-aluminum

Journal of the Acoustical Society of America

Volumn 116, Issue 1, 2004, Pages 109-116

  Zhang, X G ^a   Simpson Jr , W A ^a   Vitek, J M ^a   Barnard, D J ^b   Tweed, L J ^b   Foley, J ^b  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

^b IOWA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ATTENUATION; ELECTROMAGNETIC WAVE SCATTERING; GRAIN BOUNDARIES; NATURAL FREQUENCIES; ULTRASONICS;

GRAIN BOUNDARY SCATTERING; ULTRASONIC ATTENUATION;

COPPER;

ALUMINUM; COPPER;

ACOUSTICS; ARTICLE; MATHEMATICAL ANALYSIS; MATHEMATICAL PARAMETERS; MEASUREMENT; MODEL; PRIORITY JOURNAL; SOUND TRANSMISSION; TEMPERATURE; ULTRASOUND; VELOCITY;

EID: 3142763180     PISSN: 00014966     EISSN: None     Source Type: Journal    
DOI: 10.1121/1.1744752     Document Type: Article

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