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Volumn , Issue , 2003, Pages 122-125

RF-Schottky diodes with Ni silicide for mixer applications

Author keywords

Aluminum; Circuits; Contact resistance; Cutoff frequency; Mixers; Nickel; Radio frequency; Schottky diodes; Silicides; Silicon

Indexed keywords

ALUMINUM; BALLOONS; CONTACT RESISTANCE; CUTOFF FREQUENCY; DIODES; DOPING (ADDITIVES); ELECTRIC CONTACTS; ELECTRIC RESISTANCE; INTEGRATED CIRCUITS; MIXERS (MACHINERY); NETWORKS (CIRCUITS); NICKEL; NICKEL COMPOUNDS; PHOSPHORUS; SCHOTTKY BARRIER DIODES; SILICIDES; SILICON;

EID: 3142760234     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SMIC.2003.1196685     Document Type: Conference Paper
Times cited : (8)

References (8)
  • 6
    • 0035444020 scopus 로고    scopus 로고
    • Ni/Ag Metallization for SiGe HBTs using a Ni Silicide Contact
    • Eberhardt, J. and E. Kasper, 'Ni/Ag Metallization for SiGe HBTs using a Ni Silicide Contact', Semiconductor Science and Technology, 16, pp.47-49, 2001.
    • (2001) Semiconductor Science and Technology , vol.16 , pp. 47-49
    • Eberhardt, J.1    Kasper, E.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.