Strengthening in a copper based nanocomposite

Materials Science Forum

Volumn 455-456, Issue , 2004, Pages 244-248

  Marques, M T ^a   Correia, J B ^a   Matteazzi, P ^b  

^a INETI   (Portugal)

^b UNIVERSITY OF UDINE   (Italy)

Author keywords

Composites; Hardness; Hot extrusion; Nanocomposite

Indexed keywords

COMPOSITE MATERIALS; COPPER; ELECTRIC CONDUCTIVITY; HARDNESS; MECHANICAL ALLOYING; METAL EXTRUSION; POWDER METALLURGY; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION;

HOT EXTRUSION; INTERNAL STRESS; NANOCOMPOSITE;

NANOSTRUCTURED MATERIALS;

EID: 3142731367     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.455-456.244     Document Type: Conference Paper

References (8)

1. Metals Handbook, American Society for Metals; Vol. 7 (1984), p.293.
2. A. Gunther, A. Kumpmann and H.D. Kunze: Scripta Metall Mater Vol. 27 (1992), p.833.
3. V.Y. Gertsman and R. Birringer: Scripta Metall Mater Vol. 30 (1994), p.577.
4. H. Ferkel: Nanostruct. Mater. Vol. 11 (1999), p.595.
5. G.K. Williamson and W.H. Hall: Acta Metall. Vol. 1 (1953), p.22.
6. J.B. Correia, M.T. Marques, M.M. Oliveira and P. Matteazzi: Mater. Sci. Forum Vol. 360-362 (2001), p.241.
7. D.G. Morris: Mechanical Behavior of Nanostructured Materials (Trans Tech Publications, Switzerland 1998), p. 19, 51.
8. J. Naser, W. Riehemen and H. Ferkel: Mater. Sci. Eng. A Vol. 234 (1997), p. 470.