Consolidation of dispersion strengthened nanostructured copper via hot extrusion

Materials Science Forum

Volumn 360-362, Issue , 2001, Pages 241-246

  Correia, J B ^a   Marques, M T ^a   Oliveira, M M ^a   Matteazzi, P ^b  

^a INETI   (Portugal)

^b CSGI   (Italy)

Author keywords

Dispersion strengthening; Extrusion; Nanostructured copper

Indexed keywords

CONSOLIDATION; CRYSTAL MICROSTRUCTURE; DISPERSION HARDENING; GRAIN SIZE AND SHAPE; HEAT TREATMENT; METAL EXTRUSION; MICROHARDNESS; NANOSTRUCTURED MATERIALS; PARTICLE SIZE ANALYSIS; THERMAL EFFECTS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

HOT EXTRUSION;

COPPER POWDER;

EID: 0035003417     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.360-362.241     Document Type: Conference Paper

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