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Volumn 27, Issue 8, 2004, Pages 42-51+158

Demystifying design-for-yield

(1)  Peters, Laura a  

a NONE

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; DEFECTS; DIELECTRIC MATERIALS; ENERGY UTILIZATION; INVESTMENTS; LEAKAGE CURRENTS; LITHOGRAPHY; LSI CIRCUITS; MICROPROCESSOR CHIPS; PRODUCT DESIGN; SHRINKAGE; TRANSISTORS;

EID: 3142658622     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (4)

References (3)
  • 2
    • 0242441073 scopus 로고    scopus 로고
    • Trends in systematic non-particle yield loss mechanisms and the implication for IC design
    • Design and Process Integration for Microelectronic Manufacturing II, February
    • C.N. Berglund, "Trends in Systematic Non-Particle Yield Loss Mechanisms and the Implication for IC Design," Proc. SPIE, Vol. 5042, Design and Process Integration for Microelectronic Manufacturing II, February 2003, p. 395.
    • (2003) Proc. SPIE , vol.5042 , pp. 395
    • Berglund, C.N.1
  • 3
    • 3142691353 scopus 로고    scopus 로고
    • 'Sea of Kelvin' multiple-pattern arrangement interconnect characterization...
    • June
    • M. Okazaki, et al., '"Sea of Kelvin' Multiple-Pattern Arrangement Interconnect Characterization...," IEEE IITC, June 2004, p. 211.
    • (2004) IEEE IITC , pp. 211
    • Okazaki, M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.