Application of lock-in thermography in nondestructive evaluation of adhesively-bonded aluminum joints

Journal of Adhesion Science and Technology

Volumn 18, Issue 6, 2004, Pages 635-654

  Meola, Carosena ^a   Bruzzone, Alessandro ^b   Giorleo, Luca ^a   Morace, Renata Erica ^a   Vitiello, Antonio ^a  

^a UNIVERSITY OF NAPLES FEDERICO II   (Italy)

^b UNIVERSITY OF GENOA   (Italy)

Author keywords

Adhesively bonded aluminum joints; Infrared thermography; Nondestructive evaluation; Phase images; Surface treatments

Indexed keywords

ALUMINUM; INCLUSIONS; NONDESTRUCTIVE EXAMINATION; SEMICONDUCTOR JUNCTIONS; STATISTICAL METHODS; THERMOGRAPHY (IMAGING); ADHESIVES; INDUSTRIAL APPLICATIONS; QUALITY ASSURANCE; SUBSTRATES; SURFACE TREATMENT; TENSILE TESTING; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

ADHESIVELY-BONDED ALUMINUM JOINTS; INFRARED THERMOGRAPHY; NONDESTRUCTIVE EVALUATION; PHASE IMAGES;

ADHESIVE JOINTS; ALUMINUM;

ADHESIVE LAYERS; ALUMINUM JOINTS; BONDLINE THICKNESS; DESTRUCTIVE TESTS; EXPERIMENTAL STUDIES; GOVERNING PARAMETERS; JOINT PERFORMANCE; LAP JOINT; LOCKIN THERMOGRAPHY; NON DESTRUCTIVE EVALUATION; NON-DESTRUCTIVE TECHNIQUE; PRODUCTION STANDARDS; STATISTICAL INFERENCE; STRUCTURAL ADHESIVE; SUBSTRATE THICKNESS; TENSILE TESTS;

EID: 3142658068     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856104839356     Document Type: Article

References (32)

1. F. Nakagawa and T. Sawa, J. Adhesion Sci. Technol. 15, 119-135 (2001).
2. N. Pugno and R. Ruotolo, Struct. Eng. Mech. 13, 91-101 (2002).
3. E. Sancaktar and R. Gomatam, J. Adhesion Sci. Technol. 15, 97-117 (2001).
4. M. Zenkiewicz, J. Adhesion Sci. Technol. 15, 63-70 (2001).
5. A. J. Kinloch, Adhesion and Adhesives. Chapman and Hall, London (1987).
6. P. M. Lonardo and A. A. G. Bruzzone, International Institution for Production Research (CIRP) Annals 38 (1), 571-574 (1989).
7. P. Albericci, US Patent No. 4,690,736 (1985).
8. D. J. Arrowsmith and A. W. Clifford, US Patent No. 4,624,752 (1986).
9. J. A. Marceau, R. H. Firminhac and Y. Moji, GB Patent No. 1555940 (1979).
10. J. D. Venables, J. Mater. Sci. 19, 2431-2453 (1984).
11. Y. Bar-Cohen, Material Eval. 58, 17-30 (2000).
12. Y. Bar-Cohen, Material Eval. 58, 141-150 (2000).
13. R. D. Adams and B. W. Drinkwater, NDT&E Int. 30, 93-98 (1997).
14. L. Singher, Y. Segal, E. Segal and J. Shamir, J. Acoust. Soc. Amer. 96, 2497-2505 (1994).
15. A. N. Rider and D. R. Arnott, Int. J. Adhesion Adhesives 20, 209-220 (2000).
16. G. M. Carlomagno and P. G. Berardi, in: 3rd Infrared Information Exchange, C. Warren (Ed.), pp. 33-40. AGA, St. Louis, MO (1976).
17. A. Rosencwaig and A. Gersho, J. Appl. Phys. 47, 64-69 (1976).
18. A. Rosencwaig and G. Busse, Appl. Phys. Lett. 36, 725-727 (1980).
19. G. Busse, Appl. Opt. 21, 107-110 (1982).
20. G. Busse, D. Wu and W. Karpen, J. Appl. Phys. 71, 3962-3965 (1992).
21. G. Giorleo, C. Meola and A. Squillace, Res. Nondestr. Eval. 12, 241-250 (2001).
22. C. Meola, G. Giorleo, L. Nele, A. Squillace and G. M. Carlomagno, Nondestr. Test. Eval. 18, 83-90 (2002).
23. Infrared Observer, No. 36. Agema Infrared Systems, Milan (1996).
24. W. Karpen, D. Wu, R. Steegmuller and G. Busse, in: Proc. Quantitative Infrared Thermography QIRT 94, D. Balageas, G. Busse and G. M. Carlomagno (Eds), pp. 281-286. Editions Europeennes Thermique et Industrie, Paris, France (1994).
25. J. Rantala, D. Wu and G. Busse, Res. Nondestr. Eval. 7, 215-228 (1996).
26. D. Wu, A. Salerno, U. Malter, R. Aoki, R. Kochendorfer, P. K. Kachele, K. Woithe, K. Pfister and G. Busse, in: Proc. Quantitative Infrared Thermography QIRT 96, D. Balageas, G. Busse and G. M. Carlomagno (Eds), pp. 251-256. Edizioni ETS, Pisa (1997).
27. Dillenz, G. Busse and D. Wu, Proc. SPIE 3827, 10-15 (1999).
28. Meola, G. M. Carlomagno, A. Squillace and G. Giorleo, Measurement Sci. Technol. 13, 1583-1590 (2002).
29. C. Meola, G. M. Carlomagno and L. Giorleo, J. Adhesion Sci. Technol. 17, 1207-1222 (2003).
30. C. Meola, G. M. Carlomagno and L. Giorleo, J. Material Process Technol. (to be published).
31. R. Hadj-Ahmed, G. Foret and A. Ehrlacher, Mech. Mater. 33, 77-84 (2001).
32. M. Y. Tsai, D. W. Oplinger and J. Marton, Int. J. Solids Struct. 35, 1163-1185 (1998).