Photoelastic thermal stress measurements in scarf adhesive joints under uniform temperature changes

Journal of Adhesion Science and Technology

Volumn 15, Issue 1, 2001, Pages 119-135

  Nakagawa, Fumito ^a   Sawa, Toshiyuki ^b  

^a TOKYO METROPOLITAN COLLEGE OF AERONAUTICAL ENGINEERING   (Japan)

^b UNIVERSITY OF YAMANASHI   (Japan)

Author keywords

FEM analysis; Photoelasticity; Scarf adhesive joints; Stress concentration; Thermal stress

Indexed keywords

ALUMINUM; BOND STRENGTH (CHEMICAL); DELAMINATION; EPOXY RESINS; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); PHOTOELASTICITY; PLATES (STRUCTURAL COMPONENTS); SCARFING; STRESS CONCENTRATION; THERMAL STRESS; ADHESIVE JOINTS; ADHESIVES; ELASTICITY; PHYSICAL OPTICS;

SCARF ADHESIVE JOINTS;

ADHESIVE JOINTS; THERMAL STRESS;

ADHERENDS; ADHESIVE LAYERS; ADHESIVE THICKNESS; ALUMINUM PLATES; BUTT JOINTS; DELAMINATION GROWTH; EPOXIDE RESINS; FEM ANALYSIS; HEATSETTING; ROOM TEMPERATURE; SCARF JOINTS; STATIC TENSILE; STRESS SINGULARITIES; TEMPERATURE CHANGES; THERMAL STRENGTH; TWO-DIMENSIONAL FINITE ELEMENT ANALYSIS; UNIFORM TEMPERATURE;

EID: 0035044005     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856101743355     Document Type: Article

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