메뉴 건너뛰기




Volumn 58, Issue 3-4, 2004, Pages 74-79

Integrated circuits and 3D-packaging for low-power 24 GHZ front end

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POWER UTILIZATION; HIGH ELECTRON MOBILITY TRANSISTORS; LITHOGRAPHY; METALLORGANIC CHEMICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR MATERIALS;

EID: 3142541483     PISSN: 00161136     EISSN: None     Source Type: Journal    
DOI: 10.1515/FREQ.2004.58.3-4.74     Document Type: Article
Times cited : (3)

References (10)
  • 1
    • 0346305118 scopus 로고    scopus 로고
    • Low phase noise MMIC VCOs for ka-band applications with improved GalnP/GaAs-HBT technology
    • San Diego
    • Hilsenbeck, J.; Lenk, F.; Heinrich, W.; Würfl, J.: Low Phase Noise MMIC VCOs for Ka-Band Applications with Improved GalnP/GaAs-HBT Technology. IEEE GaAs IC Symposium Dig., San Diego, 2003, pp. 223-226.
    • (2003) IEEE GaAs IC Symposium Dig. , pp. 223-226
    • Hilsenbeck, J.1    Lenk, F.2    Heinrich, W.3    Würfl, J.4
  • 5
  • 7


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.