Technique for site-specific plan-view transmission electron microscopy of nanostructural electronic devices

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 23, Issue 3, 2005, Pages 1107-1109

  Bassim, N D ^a   Twigg, M E ^a  

^a NAVAL RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PATTERNED WAFERS; SINGLE-SIDED ION MILLING; TRANSPARENT MATERIALS; TRIPOD ANGLE LAPPING;

COPPER; ELECTRONIC EQUIPMENT; EPOXY RESINS; MILLING (MACHINING); TRANSMISSION ELECTRON MICROSCOPY; TRANSPARENCY;

NANOTECHNOLOGY;

EID: 31144445933     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1897709     Document Type: Article

References (2)

1. N. D. Bassim, M. E. Twigg, C. R. Eddy Jr., R. L. Henry, R. T. Holm, J. C. Culbertson, R. E. Stahlbush, P. G. Neudeck, A. J. Trunek, and J. A. Powell, Appl. Phys. Lett. 84, 5216 (2004).
2. M. G. Ancona, S. E. Kooi, W. Kruppa, A. W. Snow, E. E. Foos, L. J. Whitman, D. Park, and L. Shirey, Nano Lett. 3, 135 (2003).