Thermoelectric characterization of sputter-deposited BiTe bilayer thin films

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 23, Issue 3, 2005, Pages 559-563

  Liao, C N ^a   Kuo, S W ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

MICROSTRUCTURE; RAPID THERMAL ANNEALING; SILICON WAFERS; SPUTTER DEPOSITION; THERMAL CONDUCTIVITY; THERMOELECTRICITY; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

SEEBACK COEFFICIENT; THERMOELECTRIC PROPERTIES;

BISMUTH COMPOUNDS;

EID: 31044455323     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1901671     Document Type: Article

References (15)

1. C. Shafai and M. J. Brett, J. Vac. Sci. Technol. A 15, 2798 (1997).
2. G. Min and D. M. Rowe, Solid-State Electron. 43, 923 (1999).
3. V. D. Das and N. Soundararajan, Phys. Rev. B 37, 4552 (1988).
4. A. Dauscher, A. Thomy, and H. Scherrer, Thin Solid Films 280, 61 (1996).
5. H. Noro, K. Sato, and H. Kagechika, J. Appl. Phys. 73, 1252 (1993).
6. A. Giani, F. Pascal-Delannoy, A. Boyer, A. Foucaran, M. Gschwind, and P. Ancey, Thin Solid Films 303, 1 (1997).
7. J. George and B. Pradeep, Solid State Commun. 56, 117 (1985).
8. E. Charles, E. Groubert, and A. Boyer, J. Mater. Sci. Lett. 7, 575 (1988).
9. H. Zou, D. M. Rowe, and G. Min, J. Vac. Sci. Technol. A 19, 899 (2001).
10. D. G. Cahill, Rev. Sci. Instrum. 61, 802 (1990).
11. L. J. van der Pauw, Philips Tech. Rev. 20, 220 (1958).
12. M. A. Dinno, M. Schwartz, and B. Giammara, J. Appl. Phys. 45, 3328 (1974).
13. G. A. Saunders and Z. Sümengen, Proc. R. Soc. London, Ser. A 329, 453 (1972).
14. Z. Zhang, X. Sun, M. S. Dresselhaus, J. Y. Ying, and J. P. Heremans, Appl. Phys. Lett. 73, 1589 (1998).
15. R. A. Horne, J. Appl. Phys. 30, 393 (1959).