Issues in assembly process of fine pitch chip-on-flex packages for LCD applications

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 4, Issue , 2004, Pages 131-138

  Jang, Changsoo ^a   Han, Seongyoung ^a   Ryu, Jay ^a   Kim, Hangyu ^a  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); CHIP-ON-FLEX (COF) PACKAGES; LOAD BREAKAGE; NON-CONDUCTIVE ADHESIVES (NCA);

ADHESIVES; ANISOTROPY; ASSEMBLY; BONDING; COSTS; DEFORMATION; DELAMINATION; EUTECTICS; LIQUID CRYSTAL DISPLAYS; MATHEMATICAL MODELS;

ELECTRONICS PACKAGING;

EID: 23244460891     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2004-59155     Document Type: Conference Paper

References (11)

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