The role of shear stress in the formation of annealing twin boundaries in copper

Scripta Materialia

Volumn 54, Issue 6, 2006, Pages 983-986

  Field, D P ^a   Eames, R C ^a   Lillo, T M ^b  

^a Washington State University   (United States)

^b IDAHO NATIONAL LABORATORY   (United States)

Author keywords

Copper; Electron backscatter diffraction (EBSD); Equal channel angular extrusion (ECAE); Thin films; Twin boundaries

Indexed keywords

ANNEALING; GRAIN BOUNDARIES; MATERIALS SCIENCE; SHEAR STRESS; STACKING FAULTS; THIN FILMS;

ELECTRON BACKSCATTER DIFFRACTION (EBSD); EQUAL CHANNEL ANGULAR EXTRUSION (ECAE); TWIN BOUNDARIES;

COPPER;

EID: 30844436122     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2005.11.037     Document Type: Article

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