Through-wafer polysilicon interconnect fabrication with In-Situ boron doping

Materials Research Society Symposium Proceedings

Volumn 872, Issue , 2005, Pages 77-81

  Luusua, Ismo ^a   Henttinen, Kimmo ^a   Pekko, Panu ^a   Vehmas, Tapani ^a   Luoto, Hannu ^a  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

BORON; CHEMICAL MECHANICAL POLISHING; DOPING (ADDITIVES); ETCHING; OXIDATION; SILICON WAFERS;

PROCESS FABRICATION; SILICON ETCHING; THERMAL OXIDE LAYER;

OPTICAL INTERCONNECTS;

EID: 30644480772     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-872-j5.5     Document Type: Conference Paper

References (4)

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