Residual stress gradient analysis by the GIXRD method on CVD tantalum thin films

Surface and Coatings Technology

Volumn 200, Issue 8, 2006, Pages 2738-2743

  Peng, Jun ^a   Ji, V ^a   Seiler, W ^a   Tomescu, A ^b   Levesque, A ^c   Bouteville, A ^c  

^a CNRS   (France)

^b LINKÖPING INSTITUTE OF TECHNOLOGY   (Sweden)

^c Arts et Metiers ParisTech   (France)

Author keywords

CVD; Grazing incidence X ray diffraction (GIXRD); Residual stress gradient; Tantalum; Thin films

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COMPUTATIONAL GEOMETRY; CORROSION PROTECTION; RESIDUAL STRESSES; STRESS ANALYSIS; SURFACE PROPERTIES; THICKNESS CONTROL; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

GRAZING INCIDENCE X RAY DIFFRACTION (GIXRD); RESIDUAL STRESS GRADIENT ANALYSIS; TANTALUM THIN FILMS;

TANTALUM;

COATING; STRESS DISTRIBUTION; TANTALUM;

EID: 30644461073     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2004.12.018     Document Type: Article

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