Effect of packing on void morphology in resin transfer molded E-glass/ epoxy composites

Polymer Composites

Volumn 26, Issue 5, 2005, Pages 614-627

  Hamidi, Youssef K ^a   Aktas, Levent ^a   Altan, M Cengiz ^a  

^a University of Oklahoma   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PACKING PRESSURE; PLANAR SURFACES; SPATIAL DISTRIBUTION; VOID CONTENT;

COMPOSITE MATERIALS; EPOXY RESINS; FIBERS; GLASS; SURFACE PHENOMENA;

RESIN TRANSFER MOLDING;

EID: 30544431967     PISSN: 02728397     EISSN: 15480569     Source Type: Journal    
DOI: 10.1002/pc.20132     Document Type: Article

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