Effect of compression process on void behavior in structural resin transfer molding

Polymer Engineering and Science

Volumn 36, Issue 7, 1996, Pages 953-962

  Ikegawa, Naoto ^a   Hamada, Hiroyuki ^a   Maekawa, Zenichiro ^a  

^a KYOTO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSION MOLDING; DIES;

STRUCTURAL RESIN TRANSFER MOLDING;

PLASTICS MOLDING;

EID: 0030126830     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.10483     Document Type: Article

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