An elastomeric tactile sensor employing dielectric constant variation and applicable to orthodontia

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2004, Pages 564-567

  Tseng, Fan Gang ^a   Yang, Chih Sheng ^a   Pan, Li Chern ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b TAIPEI MEDICAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BIOCOMPATIBILITY; CAPACITANCE; COMPUTER SIMULATION; ELECTRODES; ELECTROSTRICTION; LOW TEMPERATURE EFFECTS; PERMITTIVITY; SENSITIVITY ANALYSIS;

ELASTOMERIC TACTILE SENSORS; LOAD CAPACITANCE; ORTHODONTIA; TEMPERATURE COEFFICIENTS;

SENSORS;

EID: 3042784605     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. A. Meckes, R. Aigner, G. Dorfinger, G. Wachutka, "Capacitive Silicon Microsensor for Force and Torque Measurement", IEEE Transducers 2001, Munich, Germany, 10-14 June, pp.498-501, 2001.
2. Z. Chu, P. M. Sarro, S. Middelhoek, "Silicon Three - Axial Tactile Sensor", IEEE Solid - State Sensors and Actuators, 25-29 June, Vol. 1, No. 22-29, pp. 656-659, 1995
3. R. J. D. Souza, K. D. Wise, "A Very high Density Bulk Micromachined Capacitive Tactile Imager", International Conference on Solid -State Sensors and Actuators, June 16-19, Chicago, USA, pp.1473-1476, 1997.
4. D. J. Griffiths "Introduction to Electrodynamics", Prentice Hall International Inc, 1996
5. T. R. Filanc-Bowen, G. H. Kim, Y. M. Shkel, "Novel Sensor Technology for Shear and Normal Strain Detection with Generalized Electrostriction", IEEE Sensor 2002, Orlando, Florida, USA, 12-14 June, Vol.2, No.12-14, pp.1648-1653, 2002.
6. J. J. Ho, Y. K. Fang, M. C. Hsieh, S. F. Ting, G. S. Chen, M. S. Ju, T. Y. Chen, C. R. Huang, C. Y. Chen, "Development of a Microelectromechanical System Pressure Sensor for rehabilitation Engineering Applications", International Journal of electronics, Vol. 87, No. 6, pp. 757-767, 2000.