Adhesion and removal of silica and alumina slurry particles during Cu CMP process

Proceedings - Electrochemical Society

Volumn 26, Issue , 2003, Pages 312-320

  Park, Jin Goo ^a   Busnaina, Ahmed A ^b  

^a Hanyang University   (South Korea)

^b NORTHEASTERN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ATOMIC FORCE MICROSCOPY; CANTILEVER BEAMS; CORROSION INHIBITORS; DIELECTRIC DEVICES; ELECTRIC FIELDS; PH EFFECTS; PROBLEM SOLVING; SCANNING ELECTRON MICROSCOPY; SILICA; SLURRIES; VAN DER WAALS FORCES;

CHEMICAL MECHANICAL PLANARIZATION (CMP); ELECTROMIGRATION PERFORMANCE; ELECTROSTATIC FORCE; GLOBAL PLANAR SURFACES;

ELECTROCHEMISTRY;

EID: 3042697146     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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