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Volumn , Issue , 2004, Pages 601-604

New fabrication process for high-performance silicon condenser microphone with monocrystalline silicon diaphragm and backplate

Author keywords

[No Author keywords available]

Indexed keywords

BOROSILICATE GLASS; CAPACITORS; CRYSTALLINE MATERIALS; ELECTRIC FREQUENCY CONTROL; ETCHING; MICROPROCESSOR CHIPS; PHOTOLITHOGRAPHY; SENSITIVITY ANALYSIS; SILICON; VOLTAGE CONTROL;

EID: 3042696953     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (10)

References (7)
  • 1
    • 0034245591 scopus 로고    scopus 로고
    • Capacitive microphone with low-stress polysilicon membrane and high-stress polysilicon backplate
    • A. Torkkeli, O. Rusanen, J. Saarilahti, H. Seppä, H. Sipola and J. Hietanen, "Capacitive microphone with low-stress polysilicon membrane and high-stress polysilicon backplate", Sensors and Actuators A 85 (2000), pp. 116-123.
    • (2000) Sensors and Actuators A , vol.85 , pp. 116-123
    • Torkkeli, A.1    Rusanen, O.2    Saarilahti, J.3    Seppä, H.4    Sipola, H.5    Hietanen, J.6
  • 2
    • 3042763781 scopus 로고    scopus 로고
    • The first low voltage, low noise differential condenser silicon microphone
    • Copenhagen, Denmark
    • P. Rombach, M. Müllenborn, U. Klein and K. Rasmussen, "The First Low Voltage, Low Noise Differential Condenser Silicon Microphone", Proceedings of Eurosensors XIV, Copenhagen, Denmark, (2000), pp. 213 - 216.
    • (2000) Proceedings of Eurosensors XIV , pp. 213-216
    • Rombach, P.1    Müllenborn, M.2    Klein, U.3    Rasmussen, K.4
  • 4
    • 0035426170 scopus 로고    scopus 로고
    • Sensitivity-improved silicon condenser microphone with a novel single deeply corrugated diaphragm
    • X. Li, R. Lin, H. Kek, J. Miao and Q. Zou, "Sensitivity-improved silicon condenser microphone with a novel single deeply corrugated diaphragm", Sensors and Actuators A 92 (2001), pp. 257-262.
    • (2001) Sensors and Actuators A , vol.92 , pp. 257-262
    • Li, X.1    Lin, R.2    Kek, H.3    Miao, J.4    Zou, Q.5
  • 5
    • 0028545959 scopus 로고
    • A silicon condenser microphone using bond and etch-back technology
    • J. Bergqvist and F. Rudolf, "A Silicon condenser microphone using bond and etch-back technology", Sensors and Actuators A 45 (1994), pp. 115-124.
    • (1994) Sensors and Actuators A , vol.45 , pp. 115-124
    • Bergqvist, J.1    Rudolf, F.2
  • 6
    • 0342581876 scopus 로고
    • Bonding process applying a flame hydrolysis technology to silicon dielectric isolated substrate production
    • Tokyo, Japan
    • R. Sawada and J. Watanabe, "BONDING PROCESS APPLYING A FLAME HYDROLYSIS TECHNOLOGY TO SILICON DIELECTRIC ISOLATED SUBSTRATE PRODUCTION", Proceedings of 1988 International Symposium of Power Semiconductor Devices, Tokyo, Japan, (1988), pp. 141 -146.
    • (1988) Proceedings of 1988 International Symposium of Power Semiconductor Devices , pp. 141-146
    • Sawada, R.1    Watanabe, J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.