Combined AFM methods to improve reliability investigations of thin oxides

IEEE International Integrated Reliability Workshop Final Report

Volumn 2002-January, Issue , 2002, Pages 151-154

  Frammelsberger, Werner ^a   Benstettea, Gunther ^a   Stamp, Richard J ^b   Kiely, Janice ^b  

^a DEGGENDORF INSTITUTE OF TECHNOLOGY   (Germany)

^b UNIVERSITY OF THE WEST OF ENGLAND   (United Kingdom)

Author keywords

AFM; C AFM; Conductive tip; IC AFM; Nano mark; Orientation mark; Overlay; Reliability; Silicon dioxide

Indexed keywords

ATOMIC FORCE MICROSCOPY; INTEGRATED CIRCUITS; PROBES; RELIABILITY; TIMING CIRCUITS;

AFM; CONDUCTIVE ATOMIC FORCE MICROSCOPY; CONDUCTIVE TIPS; IC-AFM; MEASUREMENT PROCEDURES; NANO MARKS; ORIENTATION MARK; OVERLAY; RELIABILITY INVESTIGATIONS;

SILICA;

EID: 30344438210     PISSN: 19308841     EISSN: 23748036     Source Type: Conference Proceeding    
DOI: 10.1109/IRWS.2002.1194255     Document Type: Conference Paper

References (7)

1. G. Benstetter, W. Frammelsberger, T. Schweinbock, R. J. Stamp, i. Kiely, International Reliability Workshop, Lake Tahoe, California, 2002
2. S.J. O' Shea, H.M. Atta, M.P.Murrell, M.E. Weiland Journal Vacuum Science Technology, B13(5), 1995
3. A. Olbrich, B. Ebersberger, C. Boit, Applied Physics Letter 73, 3114-3117(1998)
4. A. Olbrich, B. Ebersberger, C. Boit, 3 6th Annual International Reliability Physics Symposium, Reno, Nevada, 1998
5. H.C. Day, D.R.AUee, Applied Physics Letter 62(21), 1993
6. P. Avouris, T. Hertel, R. Martel, Applied Physics Letter 71 (2), 1997
7. http://www.di.com