Roadmap for datacom cooling

ASHRAE Journal

Volumn 47, Issue 12, 2005, Pages 52-55

  Belady, Christian L ^a   Beaty, Don ^b,c  

^a HEWLETT PACKARD COMPANY   (United States)

^b DLB ASSOCIATES CONSULTING ENGINEERS   (United States)

^c Mission Critical Facilities Technology Spaces and Electronic Equipment   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DATA COMMUNICATION EQUIPMENT; INDUSTRY; PLANNING; STANDARDS; THERMAL LOAD;

COOLING LOADS; COOLING ROADMAP; DATA CENTERS; DATACOM COOLING;

COOLING SYSTEMS;

EID: 30344436648     PISSN: 00012491     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

1. Beaty D and R. Schmidt. 2004. "Back to the future: liquid cooling - data center considerations," ASHRAE Journal 46(12).
2. Stum, K. 2002. "Design intent and basis of design: clarification of terms, structure and use." ASHRAE Transactions 108(2).
3. ASHRAE TC 9.9 2004. Thermal Guidelines for Data Processing Environments. ASHRAE Special Publications.
4. Beaty D and R. Schmidt. 2005. "Data center load characterization: connected vs. demand." Engineered Systems (1).
5. Beaty, D., N. Chauhan and D. Dyer. 2005. "High density cooling of data centers and telecom facilities - Part 1." ASHRAE Transactions 111(1).
6. The Uptime Institute. 2000. "Heat Density Trends in Data Processing, Computer Systems, and Telecommunications Equipment." Uptime Institute White Paper.
7. ASHRAE TC 9.9. 2005. Datacom Equipment Power Trends and Cooling Applications. ASHRAE Special Publications.
8. Schmidt, R., et al. 2004. "Evolution of data center environmental guidelines." ASHRAE Transactions 110(1).