Ink-jet printed passive electronic components: Metal-insulator-metal device

Digital Fabrication 2005 - Final Program and Proceedings

Volumn , Issue , 2005, Pages 76-78

  Chen, Chia Hsun ^a   Lee, Yuh Zheng ^a   Wang, Chung Wei ^a   Yang, Ming Huan ^a   Cheng, Kevin ^a   Chang, Jane ^a   Liu, Chung Ping ^b   Wang, Sha Man ^b  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b YUAN ZE UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC INSULATORS; ELECTRODES; ORGANIC SOLVENTS; POLYMERS; PRINTING;

CAPACITANCE CHARACTERISTICS; COFFEE-RING; SINGLE-LAYER INSULATOR DEVICES;

INK;

ELECTRODES; INSULATORS; POLYMERS; PRINTING; SOLVENTS;

EID: 29844433298     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. P. Harrop and R. Das, Printed Electronics: Where, why and what next (ID TechEX, Cambridge, 2004), website: http://www.idtechex.com/.
2. N. Stutzmann et al., Science 299, 1881(2003).
3. R. Deegan et al., Natural 389, 827 (1997).