Cu post-CMP cleaning and the effect of additives

Semiconductor International

Volumn 28, Issue 9, 2005, Pages 39-44

  Park, Jin Goo ^a,c,d   Busnaina, Ahmed ^b,e,f  

^a Hanyang University   (South Korea)

^b NORTHEASTERN UNIVERSITY   (United States)

^c Division of Materials and Chemical Engineering   (South Korea)

^d Hanyang University   (South Korea)

^e ASME   (United States)

^f Adhesion Society   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 29744460286     PISSN: 01633767     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (2)

1. Y.K. Hong, J.H. Han, J.H. Lee, J.G. Park and A. Busnaina, "Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP," J. Solid State Phenomena, April 2005, p. 275.
2. Y.K. Hong, D.H. Eom, S.H. Lee, T.G. Kim, J.G. Park and A.A. Busnaina, "The Effect of Additives in Post-Cu CMP Cleaning on Particle Adhesion and Removal," J. The Electrochemical Society, Vol. 151, No. 11, 2004, p. G756.